RTP\RTA CTRL
Introduction of RTP Equipment
Rapid Thermal Processing (RTP) equipment is a single-chip heat treatment equipment, which is widely used in the production of various chip products such as IC wafers, LED wafers, MEMS, compound semiconductors and power devices. It can achieve 12 inch wafers rapid heating and cooling. It uses halogen infrared lamp as the heat source and PID closed-loop temperature control to achieve extremely high temperature control accuracy and temperature uniformity, and plays an important role in the research of RTP, RTA, RTO, RTN and metal alloying of materials. In addition, RTP are also used to improve the crystal structure and optoelectronic properties and has the characteristics of high technical indicators, complex process and strong specificity.
Rapid heat treatment RTP equipment can do the following processes：
Rapid Heat Treatment (RTP), Rapid Annealing (RTA), Rapid Thermal Oxidation (RTO), Rapid Thermal Nitriding (RTN);
Ion implantation/contact annealing;
Metal alloys;
Thermal oxidation treatment;
High temperature annealing;
High-temperature diffusion;
Application fields of RTP equipment for rapid heat treatment：
Compound alloys (gallium arsenide, nitride, silicon carbide, etc.);
Polysilicon annealing;
Annealing of solar cells;
IC wafers;
power devices;
MEMS；
LED wafers
Description of the RTP Device
The annealing furnace is mainly composed of vacuum chamber, heating chamber, air intake system, vacuum system, temperature control system, air cooling system, and water cooling system.
Vacuum chamber: The vacuum chamber is the working space of the fast annealing furnace where the wafers undergo RTP.
Heating chamber: The heating chamber uses multiple infrared lamps as heating element, high-temperature resistant alloys as the frame and high-purity quartz as the main body.
Air intake system: There is an air inlet hole at the tail of the vacuum chamber. The precisely controlled air intake volume is used to meet the gas requirements of some special processes.
Vacuum system: A high vacuum solenoid valve is installed between the vacuum pump and the vacuum chamber, which can effectively ensure the vacuum degree of the chamber and avoid gas backflow from polluting the processed workpiece in the chamber.
Temperature control system: The temperature control system is composed of temperature sensors, temperature controllers, power regulators, programmable controllers, PCs and various sensors.
Air cooling system: The cooling of the vacuum chamber can be achieved by filling chamber with inert gas through the air intake system, thereby accelerating the cooling of the heat-treated workpiece and meeting meet the requirements of the process.
Water cooling system: The water cooling system mainly includes the cooling water for the vacuum chamber, the heating chamber and the sealing rings of each part.
Introduction to the Main Process of RTP Equipment
Rapid annealing (RTA): rapid Thermal Annealing
RTA is a process which heats the wafer to a higher temperature, adopt different holding times according to the material and the size of the wafer, and then carry out rapid cooling on it. The purpose is to make the internal structure of the metal reach or close to equilibrium and achieve good process performance and usability. It also has an important application in the modern semiconductor industry. Annealing of injected wafers is often carried out in a rapid Thermal process machine (RTP) where Ar or N2 is injected. The rapid heating process and short duration optimize the balance between the repair of lattice defects, activation of impurities, and minimization of impurity diffusion. RTA also reduces transient enhanced diffusion and is the best way to control the depth of the knot in shallow knot injection.
Rapid Thermal Processing (RTP)
RTP can both quickly raise the temperature of the wafer to the desired temperature of the process (200-1300°C) and quickly cool down the temperature, with a temperature change rate of 20-250°C per second.
Rapid Thermal Oxidation (RTO): Rapid Thermal Oxidation
RTO is mainly used for growing thin insulation.
Rapid Thermal Nitridation (RTN).
Ultra-thin SiO2 membranes were prepared.
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